At its 2026 North America Technology Symposium, TSMC unveiled three new fabrication nodes: A13 (a 6% density shrink of A14, fully backward-compatible with existing IP, targeting 2029), A12 (a full-node advance using second-generation nanosheet GAA transistors for data center workloads, also 2029), and N2U (a cost-optimized 2nm variant offering 3–4% performance gain or 8–10% power reduction over N2P, slated for 2028). Volume production of A16—which introduces Super Power Rail backside power delivery—slipped to 2027, a year behind the original plan. A notable strategic divergence: neither A13 nor A12 will require High-NA EUV lithography, a departure from Intel's roadmap that could pressure ASML's revenue projections of up to €60 billion by 2030.